The manufacturing process of double-sided printed circuit boards generally includes the following steps:

Raw material preparation: Select appropriate substrate materials, commonly used materials include FR-4 glass fiber composite materials, metal substrates, aluminum substrates, etc. Prepare copper foil at the same time for covering the surface of the substrate.

Printing inner layer: Covering copper foil inside the substrate, and then forming inner layer circuit patterns through processes such as photolithography and etching. This step requires the use of chemical substances such as photoresist and etching solution, as well as the use of process equipment such as UV exposure and etching equipment.

Through hole processing: Drill holes in the inner circuit pattern, and then form a conductive layer inside the hole wall through processes such as chemical copper plating to achieve the connection between the two layers of circuits.

Printing outer layer: Covering copper foil on the outer layer of the substrate, and then forming an outer circuit pattern through processes such as photolithography and etching.

Surface treatment: Chemical gold plating, tin spraying, electroplating and other processes are applied to the outer circuit to improve soldering performance and corrosion resistance.

Final product inspection: Conduct electrical performance testing, visual inspection, etc. on the finished product to ensure product quality.

The selection of materials is crucial in the manufacturing process of double-sided printed circuit boards. Generally speaking, the selection of substrate materials will be considered based on factors such as the usage environment, operating frequency, and thermal conductivity of the circuit board. Common substrate materials include:

FR-4 glass fiber composite material: It is one of the most common substrate materials, with good mechanical and insulation properties, suitable for general electronic devices.

Metal substrate: With excellent heat dissipation performance, it is suitable for applications such as high-power electronic devices and LED lighting.

Aluminum substrate: It has good heat dissipation performance and is suitable for some electronic devices that require high heat dissipation.

In addition, the selection of copper foil is also important, and different thicknesses and properties of copper foil are generally chosen according to the requirements of the circuit.

In terms of manufacturing processes, it is necessary to choose appropriate processes based on specific circuit requirements, such as chemical copper plating, tin spraying, spray coating, etc. At the same time, it is also necessary to consider environmental requirements and choose processes and materials that meet environmental standards.

In general, the manufacturing process and material selection of double-sided printed circuit boards need to comprehensively consider factors such as circuit requirements, usage environment, cost, and environmental protection to ensure the production of high-performance and high reliability electronic products.