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English中文

Process capability

projectparameterprojectparameter
Number layers2-20layerFinished thickness tolerance
(0.4mms plate thickness <0.8mm)		±0.075mm
Production board size    Max:21.5"×24.5"
    Min:14"×16"		bow and twist(min)≤0.7%
Board thickness0.3-4.0mmDrilling hole diameter (min)Min:0.20mm
Core thickness (min)0.075mmHole plating level aspect ratio (max)10:1
Finished  thickness tolerance
Board thickness ≥ 0.8mm)		±10%Hole tolerance(PTH)±0.075mm
Hole tolerance(NPTH)±0.05mmSolder mask thickness (min)≥10um
Outer layer trace width/line spacing
(min)		T/T OZ:3mil/3mil(T=1/30Z)
H/HOZ:4mil/4mil
1/10Z:6mil/6mi
2/20Z:8mil/8mil
3/30Z:10mil/10mi		soldermask bridge( min)3mil
inner layer trace width/line spacing
(min)		H/HOZ:3mil/3mi
1/10Z:3mil/3mil
2/20Z:6mil/6mil
3/3OZ:8mil/8mil		ENIG （nickel）100-300u"
Etching tolerance10%ENIG （gold）1-3u"
Solder mask accuracy tolerance±0.05mmTin thickness (hot air leveling)2.54-25.4um
Routing tolerance Edge to edge(min)±0.1mmImpedance Tolerance (min)±7%
Routing tolerance
Hole to edge)(min)		±0.1mmOSP thickness0.2-0.5um
V-CUT Thickness Tolerance (min)±0.1mmsurface treatmentOSP、ENIG、gold finger、HASL
V-CUT Angle Tolerance±5°Impedance Control and Tolerance±10%( Differential, characteristic test)
V-CUT board thickness0.5mm-
2.4mm		Resin plug hole + HDI1-3 step